焊膏印刷中影响质量的因素(pdf 4)
所属分类:生产管理知识
文件大小:219 KB
下载要求:10 学币或VIP
点击下载Abstract:Solder-paste printing plays an important part in SMT production,and afects the quality of assemblies.The
article introduces many factors of infecting quality in Solder-paste printing process and have analysed those
reasons,present some corrective actions and advice at the same time.
Key words:Solder-paste;Stencil;Printing: SMT;Defect
..............................
上一篇:焊接用语(doc 20)
下一篇:焊膏的回流焊接(doc 10)
精品资料网 m.cnshu.cn
Copyright © 2004- 粤ICP备10098620号-1