光刻缺陷检查培训英文版(ppt 47页)
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Visual Defect Introduction
Layer Code
AC:Arcing
BC / BV:Blind Contact / Blind VIA
BR :bridge
C1:Tape residue
C2 :Foreign contamination
CR :corrosion
CK:Crack
C3:Si fragment
CO:contamination
DC:Dis-color
DM:Damaged (silicon damage)
HL:Hillock
HZ:Nitride haze
LD:local defocus
MA:mis-alignment
NU:Non-uniform
OE:over etch
PA:particle
PB:PR burn
PI:Pits
PM:polymer
PC:Poor coating
PL:PR lifting
PR:PR remaining
PW:Powder
RE:Residue (ETCH)
RP:Residue (PHOTO)
RD:repeating defect
RF:roughness
SC:scratch
SN:Si precipitate
SP:Si Precipitate
UD:under develop
WS:water spot
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