薄膜物理淀积技术培训课程(PPT 54页)
所属分类:工艺技术
文件大小:4761 KB
下载要求:10 学币或VIP
点击下载第九章:薄膜物理淀积技术
Metal Layers in a Chip
Multilevel Metallization on a ULSI Wafer
Copper Metallization
Simple Evaporator
RF Sputtering System
Silicon and Select Wafer Fab Metals (at 20°C)
Junction Spiking
Formation of Self-Aligned Metal Silicide (Salicide)
Chip Performance Issues Related to a Salicide Structure
..............................
精品资料网 m.cnshu.cn
Copyright © 2004- 粤ICP备10098620号-1