焊线及焊线工艺介绍(PPT 97页)

 ASSEMBLY FLOW OF PLASTIC IC
 Wire Bond 原理
 M/C Introduction
 Wire Bond Process
 Material
 SPEC
 Calculator
 DEFECT
WIRE BOND PROCESS INTRODUCTION
CONTENTS
封裝簡介
封裝流程
Wafer Grinding
Wire Bond 原理
 B.PRINCIPLE
銲接條件
Bond Head ASSY
X Y Table
W/H ASSY
Eagle
Eagle
Bonding Process
The Wire  Bond Temp
Free air ball is captured in the chamfer
Free air ball is captured in the chamfer
Formation of a first bond
Formation of a first bondContact
Formation of a first bondBase
Capillary rises to loop height  position
Capillary rises to loop height position
Capillary rises to loop height position
Formation of a loop
Formation of a second bond
Formation of a second bondContact
Disconnection of the tail
Disconnection of  the tail
Formation of a new free air ball
Material
Leadfram (I)
Leadfram ( II )
CAPILLARY (I)
CAPILLARY (II)
CAPILLARY (III)
IC type …… loop type
Gold Wire
SPEC
BPO&BPP
Ball Size & Ball Thickness
Loop Heigh
Wire Pull
Ball Short
Shear Failure Modes
Crater Test
Calculate (I)
Calculate (II)
Quality
正常品
Material Problem
Bonding Ball Inspection
Ball Detection
Bonding Ball Inspection (cont.)
Ball Measurement
1st Bond Fail ( I )
1st Bond Fail (II)
1st Bond Fail ( III )
1st Bond Fail (IV)
1st Bond Fail (V)
Bonding Weld Inspection
Weld Detection
 2nd Bond Fail ( I )
 2nd Bond Fail ( II )
 Looping Fail(Wire Short I)
Looping Fail(Wire Short II)
Looping Fail(Wire Short III)

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